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Summary
| Description |
English: Cross-section SEM photo of SU-8 bonded wafers. |
| Date | |
| Source | M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |
| Author | Uploaded by Enaswiki at en.wikipedia |
Licensing
This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license.
Attribution: Fraunhofer ENAS
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- share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.
Original upload log
Transferred from en.wikipedia to Commons by SreeBot.
The original description page was here. All following user names refer to en.wikipedia.
Upload date | User | Bytes | Dimensions | Comment
- 2011-03-30 11:20 (UTC) | Enaswiki | 815357 (bytes) | 2546×1995 | {{Information |Description = Cross-section SEM photo of SU-8 bonded wafers. |Source = M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |Date = 11:17, 30 March 2011 (UTC) |
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:24, 27 December 2011 | | 2,546 × 1,995 (796 KB) | SreeBot | (Original text) : {{Information |Description = Cross-section SEM photo of SU-8 bonded wafers. |Source = M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |Date = 11:17, 30 M |
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