Size of this preview: 448 × 600 pixels. Other resolutions: 179 × 240 pixels | 635 × 850 pixels.
Original file (635 × 850 pixels, file size: 27 KB, MIME type: image/png)
 | This is a file from the Wikimedia Commons. Information from its description page there is shown below. Commons is a freely licensed media file repository. You can help. |
| Description | Schematic process flow of dry etch and photosensitive BCB wafer bonding technique. |
| Date | (UTC) |
| Source | J. Oberhammer and F. Niklaus and G. Stemme, Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities (2003) |
| Author | Fraunhofer ENAS, D. Neumann |
| Permission (Reusing this file) |
   This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license. Attribution: Fraunhofer ENAS
 |
File history
Click on a date/time to view the file as it appeared at that time.
| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 11:54, 10 April 2011 | | 635 × 850 (27 KB) | Enaswiki | {{Information |Description ={{en|1=Schematic process flow of dry etch and photosensitive BCB wafer bonding technique}} |Source ={{own}} |Author =Enaswiki |Date = |Permission ={{cc-by-sa-3.0-de|Fraunhofer |
File usage
The following pages on the English Wikipedia use this file (pages on other projects are not listed):
Global file usage
The following other wikis use this file:
- Usage on ca.wikipedia.org
